TSUNAMI Network Partners Newsletter ---September , 2008

Special Issue on the Second Anniversary Event of Yokohama Jisso Consortium for advanced packaging technology held on September 11, 2008 at Yokohama Symposia.

 

 

 

 

 

 

Poster Exhibition (1:00 - 2:00 PM)  
The program began with an poster session prepared not only by the supporting firms but also by universities (i.e., Yokohama National University, Fukuoka University, Nagano Prefectural Institute of Technology, Tokai University, Kanto Gakuin University, Kanagawa Institute of Technology, Tohoku University, and Kanazawa Institute of Technology). The participants listened intently to the comments by people making explanatory remarks. When the exhibition started, a lot of participants hurried to the venue in their eagerness to obtain the latest information from the university and corporate representatives. The exhibition was staged in the lobby hall, where a total of about 30 panels were displayed along the walls, and garnered a lot of interest. Thanks are due to all parties who helped to make it a success!

 

On Thursday, September 11, the symposium to commemorate the second anniversary of the founding of the Yokohama Jisso Consortium (YJC) for advanced packaging technology was held at Yokohama Symposia. The symposium attracted the participation of about 120 professionals, consisting mainly of packaging technology engineers and university people, and was a resounding success. It was followed in the evening by a reception where the participants engaged in a llvely exchange of ideas and information. The Venture Support Mechanism TSUNAMI was in charge of running the symposium, and TNP Group was involved in it as a sponsor company.
  • Date: Wednesday September 11, 2008
  • Place: Yokohama Symposia, Yokohama, Kanagawa, Japan
  • Organized by Yokohama Jisso Consortium (YJC) in association with the operation management by Specified NPO Yokohama University Venture Club (YUVEC) and Specified NPO Venture Support Mechanism TSUNAMI
  • Co-hosed by Yokohama National University
  • Supported by Kanto Bureau of Economy, Trade and Industry, Kanagawa Prefecture, Kanagawa Academy of Science and Technology (KAST), Nagano Jisso Forum, and Television KANAGAWA, Inc.
  • Sponsor companies: Zuken Inc., Kanto Branch of Alumni Association of Tohoku University, Meiko Electronics Co., PALTEK CORP., Association for Taiwan-Japan Cooperation on Industrial Technology (TJCIT), TSUNAMI Network Partners Corp., and TNP On The Road Corp.

 

 

 

 

 

 

 

Part II   Opening Speeches and Lecture (2:00 - 3:20 PM)
At 2:00 PM, the program's second part, which was taken up by opening remarks and a lecture, began in the large conference hall adjacent to the poster exhibition venue. The hall is a regular conference space that has often been the site of international conferences, and was a fitting site for celebration of the YJC's second anniversary.

The part started out with an address by Dr. Masaki Shiratori, Chairman of the YJC, which organized the program. In his remarks, Dr. Shiratori described the activities of the YJC, which has already been in existence for two years, and its future course. He was followed by noted guests who, in turn, delivered welcoming addresses of their own. (These guests were Mr. Masataka Yoshizawa, Director, Regional Economy Department, Kanto Regional Bureau of the Ministry of Economy, Trade and Industry (METI); Mr. Koichi Watanabe, Director, Science/Technology and University Liaison Office, General Policy Section, Kanagawa Prefectural Policy Department; and Mr. Takaaki Nakano, Associate Director, Center for Promotion of Industrial-Academic Collaboration, Yokohama National University.)

Next, the participants heard a lecture entitled "From Kyushu to Asia - Approaches in the Area of Semiconductor Packaging" by guest speaker Dr. Hajime Tomokage, Professor of Electronics Engineering and Computer Science in the Engineering Department at Fukuoka University. Dr. Tomokage is playing a key role in several consortiums that are centered around Kyushu and concern packaging of semiconductors. In 2007, one of them was selected to be part of the Knowledge Cluster Initiative (for the growth of knowledge-intensive enterprises) by the Ministry of Education, Culture, Sports, Science and Technlogy (MEXT). Dr. Tomokage is also active on the fronts of networking with semiconductor-related firms in Kyushu, interaction with counterparts in other Asian countries, and approaches to linkage of technology and business. In his speech, he also took up micro electromechanical systems (MEMS) and other technical concepts, and commented on a very wide range of subjects. We are deeply indebted to him for his valuable remarks.

 

 

 

 

 

 

 

 

Part IV   Reception (6:00 - 7:00 PM)
The five hours since the start of the symposium at 1:00 PM seemed to pass in a flash, and the program moved to the reception, its final part. The reception began with a short lecture by Mr. Takahide Iwama, Senior Consultant and Mr. Takafumi Nakashima, Consultant in the Technology and Manufacturing Industry Consulting Department of Nomura Research Institute. Observing that the electronics industry is now an arena of megacompetition in the environment summed up in the key words "three years, triple, and one-third," he spoke on ways of making the most of packaging technology of the material, equipment, and process types in business. Thank you, Mr. Iwama!

The lecture was followed by a buffet and animated conversation. The reception was given high marks by the participants, who had the opportunity to meet and talk with people in different industries with whom they ordinarily have limited contact. The program closed with an address by Dr. Abe of Yokohama University Venture Club (YUVEC), the NPO involved in running the symposium.

More gatherings of this sort are planned by YJC for the future. We look forward to your participation in them.

 

 

 

 

 

 

 

Part III   Panel Discussion (3:35 - 5:55 PM)
In the panel discussion, which was moderated by Dr. Shiratori, the following representatives of academia, government, and industry participated as panelists (listed in no particular order).

After brief opening statements by each of the panelists, Dr. Shiratori conducted an exchange of views on the current status of and future outlook for packaging technology and packaging as viewed from the respective standpoints of the panelists. There were insightful comments and active discussion about industry-academia collaboration and human resource development by Mr. Yoshizawa, the project for next-generation power electronics by Dr. Karasawa, the Nagano Jisso Forum by Dr. Denda, expectations of the consortium by Mr. Oshitari, the evolution of the electronics industry driven by simulation technology by Mr. Ueno, and views from the financial perspective by Mr. Go. From the floor, there were questions about how to go about identifying new promising projects and issues such as whether Japanese perspectives alone may be sufficient for human resource development. In addition, Mr. Goshi voiced desires to absorb a wider spectrum of opinion from all concerned parties in order to bolster YJC activities in the future. As this suggests, the panel discussion underscored the high hopes entertained about the YJC.